Interfacial Product of Direct Copper-Bonded Alumina Substrate
Source abstract
Abstract
Direct copper-bonded alumina substrates were widely used in large-power applications. Cu-Cu2O eutectic bonding of copper to Al2O3 was investigated in this paper. Oxygen was introduced by pre-oxidizing copper foil and it was shown that Cu-Cu2O eutectic liquid promoted the bonding between copper and Al2O3 greatly. Chemical reaction happened at the solid-liquid interface and led to the formation of the binary oxide CuAlO2, which can be observed when the specimen was prepared at 1070℃ for 60min.
Source: openalex_inverted_index · Quality: baseline
Research context
OpenAlex topics: Advanced ceramic materials synthesis · High-Temperature Coating Behaviors · Aluminum Alloys Composites Properties
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