Diamond Films Deposited on Copper Substrate with a Nickel Intermediate Layer

The chemical vapor deposition of diamond films on copper substrate with Ni intermediate layer was studied. The adhesion of the diamond film on the copper substrate was improved due to the formation of a Cu-Ni eutectic between the copper and the Ni interlayer. Scanning electron microscopy and Raman spectroscopy were used to investigate the films: The diamond films with (100) oriented diamond particles were obtained under suitable conditions, which involved scratching carefully the substrate with diamond grits and subsequently annealing the substrate with high temperature hydrogen plasma. The uniformity of the Cu-Ni-C-H eutectic influenced the uniformity of the diamond film.