Joining of 2D C/SiC Composites with Niobium Alloy

2D C/SiC and niobium alloy NbHf10-1M were successfully joined.The joining material,posited between 2D C/SiC and NbHf10-1M,was a lamination formed by a main interlayer of Ti-Cu and an assistant interlayer of Cu.The joining process consisted of solid diffusion bonding and transient liquid phase diffusion bonding (TLP-DB).The study shows that the increase of the thickness of assistant interlayer Cu can decrease the thermal stress in joint.The Ti-Cu liquid alloy formed in TLP-DB process,has good wettability with C/SiC and easily infiltrates into C/SiC and wrapes the C fibers on the joining surface.The highest shear stress of joint is 14.1 MPa.