Optimization of Electrode Material and Connecting Process for Mg-Si-Sn Based Thermoelectric Device
Source abstract
Abstract
Mg-Si-Sn摘 要: 研究了采用不同放电等离子烧结(SPS)工艺获得的单质金属(Ni、Cu、Ag、Al)电极与 Mg-Si-Sn 基热电材料 结合界面的微观形貌和成分分布特征, 测试了合金(Ni-Al、Cu-Al)、金属/合金复合电极材料的热膨胀系数、电导率 和热导率等物性参数。实验结果表明: 通过 SPS 烧结可以有效实现电极材料与 Mg-Si-Sn 基材料的连接, 复合电极 材料 Ni-Al/Al(60:40)和 Cu-
Only a short abstract or summary was supplied by the source.
Source: openalex_inverted_index · Quality: short
Research context
OpenAlex topics: Advanced Thermoelectric Materials and Devices · Heusler alloys: electronic and magnetic properties · Thermal Expansion and Ionic Conductivity
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References
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