Microstructure and Property of Thermal Insulation Coating on the Carbon Fiber Reinforced Epoxy Resin Composites
Source abstract
Abstract
A lightweight, environmentally-friendly thermal insulation coating was experimentally applied to the carbon fiber to reinforce epoxy resin composites. The coating is mainly composed of bonding layer, barrier layer and reflective layer, and prepared by using titanium dioxide, silica, aluminum oxide and hollow glass microspheres as function fillers. The addition of waterborne polyurethane with a thermal expansion coefficient of 12010 -6 K -1 as a film-forming material, is to solve the problem of cracking caused by the mismatch of the thermal expansion coefficients of the coating and the substrate material. The results show that after being applied, the coating can solidify within 24 h at room temperature. When the thicknesses of the bonding layer, the heat barrier layer and the reflective layer were 80, 120, and 90 m, the thermal insulation coating has the best performance with reflectance of the coating higher than 0.95, the thermal conductivity at 0.048 Wm -1 K -1 and the temperature difference as high as 20.1 . After being subjected to thermal shock at 190 for 6 times, and the maximum weight loss rate of the coating was 3.7%, indicating the coating highly stable. When kept at 160 for 4 h, its surface turned yellow without falling off, and its nano filler particles still remained stable.
Source: openalex_inverted_index · Quality: baseline
Research context
OpenAlex topics: Material Properties and Applications · Silicone and Siloxane Chemistry · Epoxy Resin Curing Processes
SciVX discovery tags are terminology-based. OpenAlex topics are source-provided classifications.
Affiliations
null;
2. School of Materials Science and Engineering, Central South University, Changsha 410083, China;
2. School of Materials Science and Engineering, Central South University, Changsha 410083, China;3. Key Laboratory of Nonferrous Metal Materials Science and Engineering, Ministry of Education, Central South University, Changsha 410083, China;
References (20)
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