journal article·2024-07-02Open access

A hybrid sheet of nanofiller/PDMS composite with thermal dissipation and EMI shielding properties for foldable displays

Dong-Hoon Jang, Tae-Wan Kim, Young-Do Kim, Kwan-Young Han

Journal of Information Display· Volume 25· Issue 3

Abstract

To integrate excellent heat dissipation and electromagnetic interference (EMI) shielding properties, some flexible hybrid sheets were fabricated using a polydimethylsiloxane (PMDS) matrix for a foldable display. The PDMS matrix was filled with Cu flakes and silicon carbide (SiC) powder, known for its high thermal conductivity and excellent EMI shielding properties, improving heat dissipation and EMI shielding. The acrylate resin used for an adhesive had Graphene powder and hexagonal-boron nitride (h-BN) as fillers with high heat dissipation characteristics. The optical microscopy confirmed multiple heat-transfer paths formed by the fillers. In the fabricated foldable hybrid sheet, the in-plane and out-of-plane thermal conductivities were 0.81 [Formula: see text] and 0.61 [Formula: see text], respectively. EMI shielding rate was 11.67 [Formula: see text] (X Band, 8∼12 [Formula: see text]). In addition, the hybrid sheet exhibited excellent flexibility without microcracks in 2R repeated bending tests over 300,000 cycles.
Source: openalex_inverted_index · Quality: baseline

Research context

OpenAlex topics: Electromagnetic wave absorption materials · Advanced Antenna and Metasurface Technologies · Dielectric materials and actuators

SciVX discovery tags are terminology-based. OpenAlex topics are source-provided classifications.

Affiliations

Department of Display Engineering, Dankook University, Cheonan-si, Republic of Korea

Samsung Display Co., Ltd., Yongin-si, Republic of Korea

References (34)

Show source-provided references
1. S.C. Kim, C.H. Kim, G.H. Yang, T.H. Yang, B.K. Han, S.C. Kang, and D.S. Kwon, IEEE, 69–74 (2009).
2. 10.1364/OL.36.00209810.1364/OL.36.002098 ↗
3. 10.1063/1.11253210.1063/1.112532 ↗
4. 10.1063/1.315455710.1063/1.3154557 ↗
5. 10.1109/PROC.1972.872810.1109/PROC.1972.8728 ↗
6. 10.1109/MMM.2016.253854010.1109/MMM.2016.2538540 ↗
7. C.M. Belcastro In Proceedings of the 1999 IEEE International Conference on Control Applications 2 1531–1537 (1999).10.1109/CCA.1999.801199 ↗
8. K. Murakawa N. Hirasawa H. Ito and Y. Ogura In 2014 International Symposium on Electromagnetic Compatibility 581–584 (2014).
9. 10.1007/s40820-021-00709-010.1007/s40820-021-00709-0 ↗
10. 10.1016/j.cej.2019.12336810.1016/j.cej.2019.123368 ↗
11. 10.1016/j.carbon.2021.02.04710.1016/j.carbon.2021.02.047 ↗
12. 10.3390/nano1003054110.3390/nano10030541 ↗
13. 10.1021/nl073187210.1021/nl0731872 ↗
14. 10.1038/nmat320710.1038/nmat3207 ↗
15. 10.3390/molecules2105067010.3390/molecules21050670 ↗
16. 10.1021/am507416y10.1021/am507416y ↗
17. 10.1016/S0014-3057(02)00064-210.1016/S0014-3057(02)00064-2 ↗
18. 10.1007/s10765-005-0003-410.1007/s10765-005-0003-4 ↗
19. 10.1002/(SICI)1097-4628(19991227)74:14<3396::AID-APP13>3.0.CO;2-310.1002/(SICI)1097-4628(19991227)74:14<3396::AID-APP13>3.0.CO;2-3 ↗
20. 10.1002/app.3267310.1002/app.32673 ↗
21. 10.1002/adma.20200315510.1002/adma.202003155 ↗
22. 10.1039/D0NR04023A10.1039/D0NR04023A ↗
23. 10.1016/j.carbon.2009.02.03010.1016/j.carbon.2009.02.030 ↗
24. 10.1002/mame.20210003210.1002/mame.202100032 ↗
25. 10.1016/j.sse.2017.04.00310.1016/j.sse.2017.04.003 ↗
26. H.C. Cheng, W.H. Xu, W.H. Chen, P.H. Wang, K.F. Chen, and C.C. Chang, Adv. Mater. Sci. Eng. (2015).
27. 10.1007/s10854-021-06170-410.1007/s10854-021-06170-4 ↗
28. 10.1016/j.coco.2019.12.00410.1016/j.coco.2019.12.004 ↗
29. 10.1088/1757-899X/115/1/01201210.1088/1757-899X/115/1/012012 ↗
30. 10.1016/j.compositesb.2013.11.01610.1016/j.compositesb.2013.11.016 ↗
31. 10.1016/j.tsf.2011.08.06410.1016/j.tsf.2011.08.064 ↗
32. 10.1039/D2QM00421F10.1039/D2QM00421F ↗
33. 10.1021/acsami.7b0773510.1021/acsami.7b07735 ↗
34. 10.1016/j.jiec.2019.08.02010.1016/j.jiec.2019.08.020 ↗