Effect of embedded printed circuit board (PCB) sensors on the mechanical behavior of glass fiber-reinforced polymer (GFRP) structures

The embedding of dielectric chipless sensors for cure monitoring into fiber-reinforced thermosets allows for monitoring and controlling the curing process and consequently higher quality in production. The embedded sensors remain after the processing in the structure. This affects the integrity of the composite structure locally. In order to investigate these effects on the mechanical behavior of the glass fiber-reinforced polymer (GFRP), sensors made on special low loss substrates are integrated into laminates with different lay-ups and thicknesses using vacuum assisted resin transfer molding (VARTM) method. In a parametric study the size of the sensor is varied to observe its influence on the strength and the stiffness of the laminates according to its lay-up and thickness. The size and orientation of the resin rich areas near sensors as well as the distortion in load bearing area as the consequences of the introduction of the sensors are investigated in conjunction with the strength of the structure. An empirical model is proposed by the authors which involves the previously mentioned factors and is used as a rapid tool for the prediction of the changes in bending and tensile strength of simple structures with embedded sensors. The methodology for model’s calibration as well as the validation of the model against the experimental data of different laminates with distinct lay-ups and thicknesses are presented in this work. Mechanical tests under tensile and bending loading indicate that the reduction of the structure’s strength due to sensor integration can be attributed to the size and the orientation of rich resin zones and depends over and above on the size of distorted load bearing area. Depending on the sensor’s elastic modulus the stiffness of the structure may vary through the introduction of a sensor.