Deterministic Integration of Out‐of‐Plane Sensor Arrays for Flexible Electronic Applications
Source abstract
Abstract
A design strategy for fully flexible electrode arrays with out-of-plane through polymer vias (TPVs) for monolithic 3D integration of sensor readout circuitry is presented. The TPVs are formed using copper embedded in thin polyimide structure for support. The copper interconnects offer a stable impedance frequency response from DC to 100 kHz (Z ≈ 20 Ω, θ ≈ 0°).
Source: openalex_inverted_index · Quality: baseline
Research context
OpenAlex topics: Advanced Sensor and Energy Harvesting Materials · Analytical Chemistry and Sensors · Neuroscience and Neural Engineering
SciVX discovery tags are terminology-based. OpenAlex topics are source-provided classifications.
Affiliations
Integrated Nanotechnology Laboratory and Integrated Disruptive Electronic Applications Laboratory (IDEA) Laboratory King Abdullah University of Science and Technology (KAUST) Thuwal 23955 Saudi Arabia
References (24)
Show source-provided references
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