Influence of Pad Surface Asperity on Removal Rate in Chemical Mechanical Polishing of Large-Diameter Silicon Wafer Applied to Substrate of GaN-Based LEDs
Source abstract
Abstract
Key words: silicon wafer
Only a short abstract or summary was supplied by the source.
Source: openalex_inverted_index · Quality: short
Research context
OpenAlex topics: Advanced Surface Polishing Techniques · Advanced Machining and Optimization Techniques · Anodic Oxide Films and Nanostructures
SciVX discovery tags are terminology-based. OpenAlex topics are source-provided classifications.
References
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