Microstructural Features of Lift-Off Phenomenon in Through-Hole Circuit Soldered by Sn-Bi Alloy
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Research context
OpenAlex topics: Electronic Packaging and Soldering Technologies · 3D IC and TSV technologies · Advanced Welding Techniques Analysis
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References (6)
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1. Felton · JOM. · 1993 · 45 · 2810.1007/BF03222377 ↗
2. Vincent · GEC J. Res. · 1994 · 11 · 76
3. Wood · J. Electron. Mater. · 1994 · 23 · 70910.1007/BF02651363 ↗
4. Powers · J. Electron. Mater. · 1994 · 23 · 77310.1007/BF02651372 ↗
5. Suganuma · J. Jpn. Inst. Interconnecting Packaging Electron. Circuits. · 1997 · 12 · 40610.5104/jiep1995.12.406 ↗
6. Hansen · 1958