Improvement of microstructure and interface structure of eutectic Sn–0.7Cu solder with small amount of Zn addition
Source abstract
Abstract
Abstract With small amount of Zn addition, a refined microstructure of bulk Sn–0.7Cu solder alloy has been obtained. Meanwhile, retardation effect has been observed on the growth of IMC layer at the solder/Cu joint interface. The composition variation of the interface IMC layer with the amount of Zn addition is reported and thermodynamically analyzed.
Source: openaire · Quality: candidate unverified · Source record ↗
Research context
OpenAlex topics: Electronic Packaging and Soldering Technologies · 3D IC and TSV technologies · Metallurgical and Alloy Processes
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