Semi-custom methodology to fabricate transmission electron microscopy chip for in situ characterization of nanodevices and nanomaterials

The fabrication of nanodevices on the delicate membrane window of the TEM (transmission electron microscopy) chip has the risk of breakage failure, limiting in-depth research in this area. This work proposed a methodology to address this issue, enabling secure in-situ transmission electron microscopic observation of many devices and materials that would otherwise be difficult to achieve. Combining semi-custom TEM chip design and front-side protected release technology, a variety of nanodevices were successfully fabricated onto the window membrane of the TEM chip and studied in situ. Moreover, the pressure tolerance of window membrane was investigated and enhanced with a reinforcing structure. As an example of typical applications, MoS2 devices on the TEM chip have been fabricated and electron beam-induced gate modulation and irradiation damage effects, have been demonstrated.