Induction diffusion brazing of copper to aluminium
Source abstract
Abstract
The aim of this research was to develop an induction diffusion brazing to obtain a sound joint between copper and aluminium. A foil interlayer was used to bond copper to aluminium at 600°C for 2 s under a bonding pressure of 9 MPa. The failure of tensile test is in the aluminium side and no failure occurs when the joint is bent to 180°. The electrical resistivity of joint is lower than that of aluminium. The interfacial intermetallic compounds layers are Cu 9 Al 4 and CuAl 2 with the total thickness of 2 μm. No voids and oxide scale are found in the joint. Heat treatment shows that induction diffusion brazing is superior to conventional flash welding to maintain electrical stability and mechanical integrity of copper to aluminium joint.
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Research context
OpenAlex topics: Advanced Welding Techniques Analysis · Electronic Packaging and Soldering Technologies · Aluminum Alloys Composites Properties
SciVX discovery tags are terminology-based. OpenAlex topics are source-provided classifications.
Affiliations
Department of Process Engineering and Applied Science, Dalhousie University, Halifax B3J 1Z1, Canada
State Grid Shandong Electric Power Research Institute, Jinan 250002, China
School of Materials Science and Engineering, Shandong University, Jinan 250061, China
Funding
State Grid Corporation of China
References (18)
Show source-provided references
1. 10.1179/1362171812Y.000000001010.1179/1362171812Y.0000000010 ↗
2. 10.1631/jzus.2007.A034310.1631/jzus.2007.A0343 ↗
3. 10.1109/95.29637210.1109/95.296372 ↗
4. Braunovic M. · IEEE · 1993 · 10 · 261
5. 10.1016/S0925-8388(01)00872-610.1016/S0925-8388(01)00872-6 ↗
6. 10.1016/j.jallcom.2004.07.05710.1016/j.jallcom.2004.07.057 ↗
7. 10.1016/j.jmatprotec.2008.03.00610.1016/j.jmatprotec.2008.03.006 ↗
8. 10.1016/j.actamat.2011.05.04110.1016/j.actamat.2011.05.041 ↗
9. 10.1016/j.phpro.2011.03.01810.1016/j.phpro.2011.03.018 ↗
10. 10.1016/j.phpro.2011.03.14110.1016/j.phpro.2011.03.141 ↗
11. 10.1016/j.optlastec.2013.06.00310.1016/j.optlastec.2013.06.003 ↗
12. 10.1016/j.jmapro.2013.12.00210.1016/j.jmapro.2013.12.002 ↗
13. 10.1016/j.matdes.2014.02.00410.1016/j.matdes.2014.02.004 ↗
14. 10.1007/s40194-015-0280-x10.1007/s40194-015-0280-x ↗
15. 10.1179/13621710422502172410.1179/136217104225021724 ↗
16. 10.1080/0950711070184390210.1080/09507110701843902 ↗
17. Bhadeshia H. K. D. H.: Proc. Int. Conf. on ‘Aluminum’, New Delhi, India, April 2003, Aluminium Association of India, Paper 195–204.
18. 10.1179/stw.1997.2.3.8910.1179/stw.1997.2.3.89 ↗