Deposition and phase transformation behaviors of Ti–Ni-Hf-Cu quaternary shape memory alloy thin films
Source abstract
Abstract
Abstract In the present study, Ti–Ni-Hf-Cu thin films were successfully fabricated by magnetron sputtering process. Moreover, the effects of various factors on the quality of Ti–Ni-Hf-Cu thin film were investigated and the optimal processing parameters were determined. The results reveal that the composition and quality of Ti–Ni-Hf-Cu thin film can be mainly tailored by changing the sputtering power and Ar pressure. The amorphous Ti–Ni-Hf-Cu thin films with the high-quality can be obtained at the following condition: sputtering power = 150 W; Ar pressure = 0.6 Pa; sputtering time = 6 h. The annealed Ti–Ni-Hf-Cu thin film consisted of monoclinic B19′ martensite phase and nano-scale (Ti,Hf)2Ni type precipitate. Compared with the bulk Ti–Ni-Hf-Cu alloy, the annealed Ti–Ni-Hf-Cu thin film showed the lower martensitic transformation temperature. Nevertheless, the forward martensitic transformation starting temperature of the annealed Ti–Ni-Hf-Cu thin film was still higher than 100 °C, which can meet the requirement of the high temperature application field.
Source: openaire · Quality: candidate unverified · Source record ↗
Research context
OpenAlex topics: Shape Memory Alloy Transformations
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