journal article·2023-04

Planar defects-induced low thermal conductivity in a superhard material SiB6

Sora-at Tanusilp, Masaya Kumagai, Yuji Ohishi, Manabu Ishimaru, Naoki Sadayori, Ken Kurosaki

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Abstract

Generally materials with low thermal conductivity require weaker interatomic bonding, considered as soft materials. Here we demonstrate that SiB 6 with planar structural defects shows low thermal conductivity, but uncommonly high strength. Planar defects-induced polycrystalline SiB 6 (PD-SiB 6 ) has a relatively large Vickers hardness, which is comparable to those of well-known superhard materials, despite of relatively low thermal conductivity (<10 W m -1 K -1 at 300 K). Transmission electron microscopy observations confirmed the presence of numerous planar defects, which were thought to contribute to the improvement of hardness. Thanks to the special characteristics of a trade-off relationship between low thermal conductivity and high strength, we believe that PD-SiB 6 can be used in new strategies of controlling thermal and mechanical properties in various functional materials.
Source: expertdata · Quality: candidate unverified · Source record ↗

Research context

OpenAlex topics: Thermal properties of materials · Boron and Carbon Nanomaterials Research · Superconductivity in MgB2 and Alloys

SciVX discovery tags are terminology-based. OpenAlex topics are source-provided classifications.

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