Fabrication of nanoporous-nanotwinned Cu by dealloying and its application for high-power device packaging
Source abstract
Abstract
Due to the demanding operating conditions of high-power devices, efficient heat dissipation during packaging is essential. In this study, nanoporous Cu (NP-Cu) with high thermal conductivity (293.3 W/(mK)) was fabricated through co-electroplating Cu-Zn followed by dealloying. Analysis by transmission electron microscopy shows that the NP-Cu consists of nanocrystalline grains with a grain size of 50 nm, 15 % porosity, and its pore size was about 40 nm. The NP-Cu grains also contains nanotwins with a twin spacing of 5 nm. The results showed that using NP-Cu as an interlayer increased the bonding fractions and enabled successful bonding at lower temperatures and pressures. The NP-Cu possessed low yield strength, allowing it more adaptable to various levels of surface roughness and facilitating the bonding. Highly < 111 > -oriented NT-Cu was also applied to enhance bonding. The high-conformity combination of NP-Cu and NT-Cu created a bonding structure with both high thermal conductivity and good reliability, making it a potential thermal interface material (TIM) for high-power device packaging.
Source: openalex_inverted_index · Quality: baseline
Research context
OpenAlex topics: Nanoporous metals and alloys · Supercapacitor Materials and Fabrication · Anodic Oxide Films and Nanostructures
SciVX discovery tags are terminology-based. OpenAlex topics are source-provided classifications.
References (42)
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