journal article·2025-01Open access

Liquid-copper infiltration and characterization of additively manufactured W-lattice structures

Aljaž Iveković, Gokula Krishna Muralidharan, Andrei Galatanu, Guichuan Li, Kim Vanmeensel, Jef Vleugels

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OpenAlex topics: Advanced materials and composites · Electronic Packaging and Soldering Technologies · 3D IC and TSV technologies

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