A promising Co-P/Ni-P multi-layer barrier layer for Bi2Te3 based thermoelectric device
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OpenAlex topics: Advanced Thermoelectric Materials and Devices · Advanced Thermodynamics and Statistical Mechanics · Topological Materials and Phenomena
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References (57)
Show source-provided references
1. Recent progress of two-dimensional thermoelectric materials
2. Machine learning approaches for thermoelectric materials research
3. Decoupling Seebeck coefficient and resistivity, and simultaneously optimizing thermoelectric and mechanical performancesfor n-type BiTeSe alloy by multi-pass equal channel angular extrusion10.1016/j.mseb.2020.114846 ↗
4. Microstructural refinement and performance improvement of cast n-type Bi2Te2.79Se0.21 ingot by equal channel angular extrusion
5. Artificial porous structure: an effective method to improve thermoelectric performance of Bi2Te3 based alloys10.1016/j.jssc.2019.121060 ↗
6. Na doping in PbTe-solubility, band convergence, phase boundary mapping, and thermoelectric properties10.1021/jacs.0c07067 ↗
7. Substitutions and dislocations enabled extraordinary n-type thermoelectric PbTe
8. Routes for advancing snte thermoelectrics10.1039/D0TA05458E ↗
9. Mechanical alloying boosted snte thermoelectrics
10. Achieving a fine balance in mechanical properties and thermoelectric performance in commercial Bi2Te3 materials10.1016/j.ceramint.2020.03.029 ↗
11. Flexible thermoelectric films based on Bi2Te3 nanosheets and carbon nanotube network with high n-type performance10.1021/acsami.0c21396 ↗
12. Parametric study of asymmetric thermoelectric devices for power generation10.1002/er.5461 ↗
13. Thermoelectric devices: a review of devices, architectures, and contact optimization10.1002/admt.201700256 ↗
14. Performance analysis and optimization of the rough-contact Bi2Te3-based thermoelectric cooler via metallized layers10.1016/j.csite.2022.102522 ↗
15. The universal influence of contact resistance on the efficiency of a thermoelectric generator10.1007/s11664-015-3731-7 ↗
16. Unraveling the critical role of melt-spinning atmosphere in enhancing the thermoelectric performance of p-type Bi0.52Sb1.48Te3 alloys10.1021/acsami.0c09656 ↗
17. Cold-sintered Bi2Te3-based materials for engineering nanograined thermoelectrics10.1021/acsaem.1c03540 ↗
18. 3D-Printed porous thermoelectrics for in situ energy harvesting10.1021/acsenergylett.2c02425 ↗
19. Lattice architectures for thermoelectric energy harvesting10.1021/acsenergylett.4c00680 ↗
20. Thermoelectric nanowires for dense 3D printed architectures10.1039/D3MH01646C ↗
21. Effect of Solder and Barrier Layer Elements on the Thermoelectric Properties of Bi0.5Sb1.5Te310.1088/2053-1591/ab3cd5 ↗
22. Influence of Ni and Cu electrodeposits on the interfacial reaction between SAC305 solder and the Bi2(Te,Se)3 thermoelectric material10.1007/s10854-019-01852-6 ↗
23. Interfacial reactions between pure Cu, Ni, and Ni–Cu alloys and p-type Bi2Te3 bulk thermoelectric material10.1007/s10853-021-06358-3 ↗
24. Kinetic study of solid-state interfacial reactions of p-type (Bi,Sb)2Te3 thermoelectric materials with Sn and Sn-Ag-Cu solders
25. Performance of Bi2Te3-based thermoelectric modules tailored by diffusion barriers
26. Interfacial reactions in thermoelectric modules10.1080/21663831.2018.1436092 ↗
27. Recent progress in thermoelectric devices and applications10.1016/j.cej.2025.159929 ↗
28. Ni barrier in Bi2Te3-based thermoelectric modules for reduced contact resistance and enhanced power generation properties10.1016/j.jallcom.2019.04.293 ↗
29. Synergetic effect of Bi2Te3 alloys and electrodeposition of Ni for interfacial reactions at Solder/Ni/Bi2Te3 joints10.1016/j.jallcom.2017.02.300 ↗
30. Study of diffusion barrier for Solder/n-type Bi2Te3 and bonding strength for p- and n-type thermoelectric modules10.1007/s11664-017-5906-x ↗
31. Interfacial reactions between ni and Bi2(Se0.1Te0.9)3 and its constituent material systems10.1016/j.jallcom.2017.09.261 ↗
32. Effects of the Ni electrodeposit on microstructure evolution and electrical resistance of the p-type Bi2Te3 solder joint10.1016/j.jallcom.2020.155006 ↗
33. Effects of microstructure of Ni barrier on bonding interface diffusion behaviors of Bi-Te-based thermoelectric material
34. Thermal stability and interfacial structure evolution of Bi2Te3-based micro thermoelectric devices10.1016/j.jallcom.2021.163090 ↗
35. Enhanced thermoelectric properties of metal film on bismuth telluride-based materials10.1016/j.tsf.2014.04.025 ↗
36. Electroless Co-P diffusion barrier for n-PbTe thermoelectric material10.1016/j.jallcom.2017.09.051 ↗
37. Influence of the P content on phase formation in the interfacial reactions between Sn and electroless Co(P) metallization on Cu substrate10.1016/j.jallcom.2014.09.017 ↗
38. C.W. Chiu, Solid-state interfacial reactions of Sn and Sn–Ag–Cu solders with an electroless Co(P) layer deposited on a Cu substrate10.1016/j.jallcom.2015.12.060 ↗
39. Interface reaction between an electroless Ni–Co–P metallization and Sn–3.5Ag lead-free solder with improved joint reliability10.1016/j.actamat.2014.02.026 ↗
40. Co-P diffusion barrier for p-Bi2Te3 thermoelectric material10.1007/s11664-018-6633-7 ↗
41. Interfacial stability in Bi2Te3 thermoelectric joints10.1021/acsami.9b22853 ↗
42. Microstructural evolution and failure mechanism dominated by Bi, Sb cooperative diffusion at p-type thermoelectric pillar Bi-Sb-Te/Sn interface10.1016/j.apsusc.2023.158449 ↗
43. Analysis on the growth and growth-dependent microhardness of Ni3Sn4 intermetallic compound phase in directionally solidified Sn-Ni alloy10.1016/j.jallcom.2019.153397 ↗
44. Interfacial reaction of Ni3Sn4 intermetallic compound in Ni/SnAg solder/Ni system under thermomigration10.1016/j.jallcom.2016.03.020 ↗
45. Growth mechanism of Ni3Sn4 in a Sn/Ni liquid/solid interfacial reaction10.1016/j.actamat.2009.07.021 ↗
46. Surface treatment by crystalline Co-P Coating with ultra-thin CoTe2 layer for improved electrical and mechanical properties of the n-type Bi2Te3/Sn TEG electrode10.1016/j.apsusc.2023.158856 ↗
47. Phase evolutions and growth kinetics in the Co–Sn system10.1007/s42452-019-0207-z ↗
48. Significantly enhanced shear strength of Sn-Ag-Cu/Co-P ball grid array solder joints by CoSn3 intermetallic compound
49. Formation, processing and characterization of Co–Sn intermetallic compounds for potential integration in 3d interconnects10.1016/j.mee.2015.04.116 ↗
50. Phase evolutions and growth kinetics in the Co–Sn system10.1007/s42452-019-0207-z ↗
51. Structure characteristics of electroless Ni-P/Ni-Co-P alloy deposits on sintered NdFeB permanent magnets, Rare
52. Effect of substrate annealing on the wetting of metastable BNi-2 ribbons by molten Sn10.1063/1.3399767 ↗
53. Interrelation between onset of crystallization and internal stresses in amorphous metallic alloys
54. Wettability in reactive Sn-base alloy/Ni-base metallic glass systems10.1016/j.apsusc.2013.03.110 ↗
55. Understanding of the contact of nanostructured thermoelectric n-type Bi2Te2.7Se0.3 Legs for power generation applications10.1039/c3ta13456c ↗
56. Electrical resistance of metal contact to Bi2Te3 based thermoelectric legs10.1063/1.5117183 ↗
57. Electronic structures and stability of Ni/Bi2Te3 and Co/Bi2Te3 interfaces10.1088/0022-3727/43/11/115303 ↗