Effects of Tellurium addition on the microstructural evolution and properties of Sn-0.7Cu lead-free solder alloy
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OpenAlex topics: Electronic Packaging and Soldering Technologies · Metallurgical and Alloy Processes · Intermetallics and Advanced Alloy Properties
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References (49)
Show source-provided references
1. Effect of Co addition into Ni film on shear strength of solder/Ni/Cu system: experimental and theoretical investigation10.1016/j.msea.2020.139589 ↗
2. Tensile, hardness and microstructural properties of Sn-Pb solder alloys
3. Six cases of reliability study of Pb-free solder joints in electronic packaging technology10.1016/S0927-796X(02)00007-4 ↗
4. Al and Si alloying effect on solder joint reliability in Sn-0.5Cu for automotive electronics10.1007/s11664-016-4837-2 ↗
5. Topics in lead-free solders: interfacial and Sn Whisker growth10.1007/s11837-012-0443-9 ↗
6. Influence of temperature gradient bonding on the micromorphology and shear performance of Sn-based solder joints: experiments and first principles calculations10.1016/j.jmapro.2024.05.057 ↗
7. Shear strength and fracture behavior of reflowed Sn3.0Ag0.5Cu/Cu solder joints under various strain rates10.1016/j.jallcom.2016.08.168 ↗
8. Effects of Ni modified MWCNTs on the microstructural evolution and shear strength of Sn-3.0Ag-0.5Cu composite solder joints10.1016/j.matchar.2020.110287 ↗
9. Effects of ultrasonic treatment on mechanical properties and microstructure evolution of the Cu/SAC305 solder joints10.1016/j.jmapro.2021.01.045 ↗
10. Intermetallic compound evolution and mechanical properties of Sn-0.7Cu-0.1Ni-xZn lead-free solder alloys prepared by directional solidification
11. Electrochemical corrosion behavior of Sn-0.7Cu solder alloy with the addition of bismuth and iron10.1016/j.jallcom.2019.151925 ↗
12. The behavior of Sn whisker growth on Sn-0.7Cu-0.05Ni solder joint during thermal cycling10.1007/s10854-024-13805-9 ↗
13. Wetting of Sn-Zn-Ga and Sn-Zn-Na alloys on Al and Ni substrate10.1007/s11664-017-5791-3 ↗
14. Effect of Ni on the microstructure and properties of Sn-6.5Zn-3.0Bi solders10.1080/14786435.2022.2118384 ↗
15. Influences of Ag addition to Sn-58Bi solder on SnBi/Cu interfacial reaction10.1016/j.matlet.2017.11.127 ↗
16. Comparison of high-speed shear properties of low-temperature Sn-Bi/Cu and Sn-In/Cu solder joints10.1007/s10854-024-12302-3 ↗
17. Effects of Ag content on microstructure evolution, intermetallic compound (IMC) and mechanical behaviour of SAC solder joints10.1016/j.microrel.2023.115103 ↗
18. Interface reaction and intermetallic compound growth behavior of Sn-Ag-Cu lead-free solder joints on different substrates in electronic packaging10.1007/s10853-018-2907-y ↗
19. Improvement in thermomechanical reliability of low cost Sn-based BGA interconnects by Cr addition10.3390/met8080586 ↗
20. Cu6Sn5 crystal growth mechanisms during solidification of electronic interconnections10.1016/j.actamat.2016.12.043 ↗
21. Effects of Cu contents in Sn-Cu solder on the composition and morphology of intermetallic compounds at a Solder/Ni interface10.1557/JMR.2005.0275 ↗
22. Interfacial reactions between Sn-0.4Cu solder and Cu substrate with or without ENIG plating layer during reflow reaction10.1016/j.jallcom.2004.12.009 ↗
23. Critical properties of Cu6Sn5 in electronic devices: Recent progress and a review10.1016/j.cossms.2015.08.001 ↗
24. The Cu-Sn phase diagram, part I: new experimental results10.1016/j.intermet.2012.10.004 ↗
25. The superstructure of domain-twinned η'-Cu6Sn510.1107/S0108768194004052 ↗
26. K. Nogita, S. Suenaga, S.D. McDonald, H. Tsukamoto, J. Read, T. Nishimura, Inhibition of cracking in Cu6Sn5 intermetallic compounds at Sn-Cu lead-free solders and Cu substrate interfaces[C]//Proc. of Int. Conf. on Electronics Packaging (ICEP), Kyoto, Japan, 2009, pp. K14-2-2.10.5104/jiepeng.2.46 ↗
27. Interfacial microstructure evolution and shear strength of Sn0.7Cu-xNi/Cu solder joints10.1007/s10854-018-9219-5 ↗
28. Effects of Zn and Sb additions on micro-structure, creep behavior and thermal properties of binary eutectic Sn-0.7%Cu lead-free solder
29. Microstructural and creep characterization of Sn-0.7Cu and Sn-0.7Cu-xBi lead-free solders for low cost electronic
30. Effect of Ni on the suppression of Sn whisker formation in Sn-0.7Cu solder joint10.3390/ma14040738 ↗
31. Microstructure and brazing properties of Sn-0.7Cu solder with different trace Si contents
32. Enhancement mechanism of Te doping on microstructure, wettability and mechanical properties of Sn-Bi-based solder10.1016/j.msea.2022.143445 ↗
33. Leveraging prior strain rates effect during stress relaxation of Sn-1.7Ag-0.7Cu lead-free alloys with microalloying of Te and Co for microelectronics applications10.1007/s10854-019-01758-3 ↗
34. Surface tension and its temperature coefficient of molten tin determined with the sessile drop method at different oxygen partial pressures10.1006/jcis.2002.8589 ↗
35. Surface and transport properties of Ag-Cu liquid alloys10.1016/j.susc.2004.12.009 ↗
36. Critical surface tension values of Group VIA elements10.1021/j100872a047 ↗
37. The Sn-Te (Tin-Tellurium) system
38. Improvements in the properties of low-Ag SAC105 solder alloys with the addition of tellurium10.1007/s10854-023-10704-3 ↗
39. The influence of Ag on the microstructure, thermal properties and mechanical behavior of Sn-25Sb-xAg high temperature lead-free solder10.1016/j.vacuum.2020.110015 ↗
40. Bragg's law with refraction10.1107/S0108767388012243 ↗
41. Mechanical property optimization of Sn-1.5Ag-0.5Cu solder alloys with additions of Bi, In, and Te10.1088/1402-4896/ad4c14 ↗
42. Effect of electromigration and thermal ageing on the Tin whiskers’ formation in thin Sn-0.7Cu-0.05Ga lead (Pb)-free solder joints10.3390/coatings11080935 ↗
43. Effect of indium on microstructure, mechanical properties, phase stability and atomic diffusion of Sn-0.7Cu solder: experiments and first-principles calculations10.1016/j.msea.2022.143938 ↗
44. Cobalt-Graphene NanoSheets enhanced Sn-0.3Ag-0.7Cu composite solder: study on microstructure, crystal orientation relations and mechanical properties10.1016/j.msea.2024.146199 ↗
45. Imaging the polymorphic transformation in a single Cu6Sn5 grain in a solder joint10.3390/ma11112229 ↗
46. Synergic effect of Te, Ni and MWCNT on creep behavior and microstructural evolution of Sn-1.0Ag-0.7Cu low-Ag solder10.1016/j.jallcom.2022.163808 ↗
47. The influence of Ni and Zn additions on microstructure and phase transformations in Sn-0.7Cu/Cu solder joints10.1016/j.actamat.2014.10.003 ↗
48. The effect of Bi on the microstructure, electrical, wettability and mechanical properties of Sn-0.7Cu-0.05Ni alloys for high strength soldering10.1016/j.matdes.2019.108281 ↗
49. Properties enhancement of SnAgCu solders containing rare earth Yb10.1016/j.matdes.2013.12.076 ↗