Comparative study of as-annealed pure Al and Al–Te: An insight into texture-electrical/mechanical property correlations

The effects of the microstructure on the electrical conductivity (EC) and tensile performance of as-annealed Al and Al–Te were comparatively investigated for the first time. The correlation between the texture evolution and EC was revealed using the latest research approach. The results show that the addition of Te (0.1 wt%) enhanced the EC compared with that of the as-annealed pure Al and slightly decreased the tensile strength and static toughness. In the as-annealed pure Al, the texture transition rate X _Trans showed positive correlations with the EC. Therein, the Cube {001} <100> texture played a decisive role in the EC, and the intensity of the Brass {001} <112> orientation played a leading role in the tensile strength. Te microalloying enhanced the deformation texture and retarded the recrystallization of the Al-Te alloy. Increasing the texture index F _CGB was beneficial for improving the static toughness (S). The inverse function of dislocation density F _KAM (=1/θ), which is inversely proportional to the dislocation density, exhibited a positive correlation with the EC. A high value of texture index X _CB corresponded to a low dislocation density, and the quasi-spherical shell structure, composed of a Te layer and FeAl ₂, contributed to improving the EC.