Improved interfacial mechanical properties between PZT piezoelectric ceramic and Ag metallization layer by in-situ-formed CuO nanoparticles
Source abstract
Abstract
In-situ-formed CuO nanoparticles were used to improve the interfacial mechanical properties between lead zirconate titanate (PZT) ceramic and metallization layer. The effects of CuO particles on the mechanical properties of PZT/Ag interfaces were studied, and the damage evolutions of the PZT-CuO/Ag interfaces were analyzed. The results showed that both the maximum peeling stress σ max and shear stress τ max of the PZT-CuO/Ag interfaces increased by approximately 200 %, while the critical fracture energy G IC of the interface was increased at most by seven times. The enhanced mechanical properties of the PZT-CuO/Ag interfaces originated from the high bonding strength between CuO and Ag layer and the effective stress concentration relief. Crack deflection and crack pinning effects promoted the enhancement of interfacial fracture toughness. The optimal size of the CuO particles at the PZT/Ag interface was approximately 100 nm. Notably, the electron transport between the PZT ceramic and Ag layer was not degraded with the introduction of CuO nanoparticles.
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Research context
OpenAlex topics: Epoxy Resin Curing Processes · Injection Molding Process and Properties · Synthesis and properties of polymers
SciVX discovery tags are terminology-based. OpenAlex topics are source-provided classifications.
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