High-throughput determination of interdiffusivity matrices and atomic mobilities in Cu-rich fcc Cu-Sn-Zn alloys by using the experimental composition profiles and HitDIC
Source abstract
Abstract
In this paper, 12 groups of ternary Cu-Sn-Zn diffusion couples at 873, 973 and 1073 K were prepared and their composition profiles were measured. A high-throughput determination of atomic mobilities in Cu-rich fcc Cu-Sn-Zn alloys was performed by using HitDIC (HIgh-Throughput Determination of Interdiffusion Coefficients, https://hitdic.com/) software in the framework of the numerical inverse method. A unified set of atomic mobility parameters were thus acquired and excellent prediction performance towards all the composition profiles of the prepared diffusion couples was achieved. Good consistence between interdiffusion coefficients inferred by the assessed mobility descriptions and those evaluated with Matano-Kirkaldy method were successfully achieved. Reliability and soundness of evaluated mobility descriptions were therefore proved. Exploration of various diffusion properties including interdiffusivity and related Arrhenius information among the concerned temperature and composition range was also carried out. Insight into the composition and temperature-dependence of various diffusion properties in fcc Cu-Sn-Zn alloy were subsequently retrieved and discussed.
Source: expertdata · Quality: candidate unverified · Source record ↗
Research context
OpenAlex topics: Electronic Packaging and Soldering Technologies · Aluminum Alloy Microstructure Properties · High Temperature Alloys and Creep
SciVX discovery tags are terminology-based. OpenAlex topics are source-provided classifications.
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