Conformal BN coating to enhance the electrical insulation and thermal conductivity of spherical graphite fillers for electronic encapsulation field

Herein, we provided a structural design strategy of constructing boron nitride (BN) conformal coating on the surface of the spherical graphite (SG) particles via precursors deposition and high-temperature pyrolysis method to achieve improved electrical insulation. The dissolved and reprecipitated BN precursors were uniformly deposited on the surface of polydopamine-modified SG through strong adhesion and hydrogen bonding of polydopamine. Then, the homogeneous and dense BN ceramic coating was formed on the surface of SG via slow pyrolysis at high temperature. The complete encapsulation of BN coating prevents the SG particles directly contacting with each other in the silicon rubber (SR) matrix to retain electrical insulation of SR composites. Furthermore, the BN coating flattens the uneven surface of SG so that the fillers are better infiltrated by the SR matrix. The small specific surface area of SG@BN filler particles is beneficial to significantly reduce the generation of the filler/matrix interfaces and weaken phonons scattering, thus decreasing the thermal boundary resistance. As a result, the thermal conductivity of prepared SG@BN/SR composites is up to 3.65 W m ⁻¹ K ⁻¹, which is 20.2-fold of that of pure SR with 0.18 W m ⁻¹ K ⁻¹. And the SG@BN/SR composites exhibit a satisfactory breakdown voltage of 5.6 kV mm ⁻¹, which is much higher than 1.1 kV mm ⁻¹ for the original SG/SR composites. This strategy is worth using for reference to extend the application of graphite-type fillers in the electronic encapsulation field.