Electromigration characteristics of CuAl2
Source abstract
Abstract
Intermetallic compounds with good thermal stability and low electrical resistivity have opened up a new field of application as interconnect materials in advanced electronic devices; however, its reliability under operating conditions remains unknown. This study focuses on CuAl 2 intermetallic compound and its electromigration (EM) reliability with reference to the results of Cu pure metal. Characteristic parameters and mechanisms related to EM are investigated, including microstructure damage, drift velocity, activation energy, critical length, and lifetime. The results demonstrate that CuAl 2 has superior EM reliability compared with the conventional Cu interconnect material.
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Research context
OpenAlex topics: Copper Interconnects and Reliability · Electronic Packaging and Soldering Technologies · Semiconductor materials and interfaces
SciVX discovery tags are terminology-based. OpenAlex topics are source-provided classifications.
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