Microstructure evolution and multi-reinforcement mechanisms in Al-Cu-Ag alloys

As one of the most commonly used binary alloys, the effect of intermetallic compounds (IMCs) of Al-Cu alloys in powder metallurgy on their structure and properties is instructive for tailoring Al-Cu alloys for different applications. In this investigation, a series of Al-Cu-Ag alloys with varying Cu compositions were fabricated via hot pressing. TEM analysis identified CuAl ₂ as the primary intermetallic compounds, with Ag existing in forms including Ag ₂ Al, elemental Ag, and an Ag-(Cu) solid solution. The modulation of Cu content influenced the state of Ag and the mechanical behaviors of the Al-Cu-Ag alloy. Particularly, the high Al/Cu alloy, benefiting from a synergistic effect comprising stacking faults, nanoscale precipitates, and solid solutions, exhibited outstanding mechanical properties. Conversely, the Al-50Cu-3Ag alloys displayed significant brittleness, attributed to the adverse impact of large-scale intermetallic compounds and increased grain size due to the formation of CuAl ₂ . The incorporation of nanoparticles effectively mitigated the grain size in high Al/Cu alloys. This study elucidates the correlation between the evolution of intermetallic compounds and composition in Al-Cu alloys, offering novel insights into the reinforcement of both Al-based and Cu-based alloys.