Investigation of the glass forming regularity and thermal behavior of lead-free V2O5-TeO2-RO (R = Ca, Sr, Ba) low temperature sealing glass for electronics packaging
Source abstract
Abstract
Lead-free V 2O 5-TeO 2 glass systems are promising new sealant materials for electronics vacuum packaging, with low-melting temperature and unique light absorption. The glass forming regularity, structure and corresponding properties of the V 2O 5-TeO 2 -RO (R=Ca, Sr, Ba) glass system are systematically studied and analyzed in this paper. The results show that there is a wide glass forming region for the V 2O 5-TeO 2-RO glass system, and with the increase of TeO 2/V 2O 5 molar ratio, the thermal stability of V 2O 5-TeO 2 -SrO glass with the RO content of 20 mol% increases and the coefficient of thermal expansion increase from 11.2 to 15.86 × 10–6/°C due to transformation process of glass network structure from the [VO4] to transition state [TeO3 + 1] and [TeO3] group. The higher initial crystallization temperature of 40 mol%V 2O 5-40 mol%TeO 2 -20 mol%SrO glass is conducive to the flow of the glass slurry during the sealing process, obtaining a sealing device with good airtightness at extremely low temperatures of 350 °C.
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Research context
OpenAlex topics: Glass properties and applications · Surface Roughness and Optical Measurements · Luminescence Properties of Advanced Materials
SciVX discovery tags are terminology-based. OpenAlex topics are source-provided classifications.
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