journal article·2009-10

Growth temperature and plasma power effects on N incorporation in InSbN grown by molecular beam epitaxy

K. P. Lim, H. T. Pham, S. F. Yoon, A. Markwitz, N. Yakovlev

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Abstract

Abstract Dilute nitride InSbN alloys have been grown using radio frequency plasma‐assisted molecular beam epitaxy. The effects of low growth temperature (270–330 °C) and nitrogen plasma power (150–180 W) on the N incorporation were studied. From the X‐ray diffraction (XRD), secondary ion mass spectroscopy and the nuclear reaction analysis (14N(d,p5)15N), the highest ratio of substitutional NSb over the undesired interstitial N is yielded at the lower limit of 270 °C. Like NSb, a large amount of interstitial N–N also contribute to lattice contraction. Increasing the plasma power (180 W) results in a significant increase in interstitial N in [011] direction. (© 2009 WILEY‐VCH Verlag GmbH & Co. KGaA, Weinheim)
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Research context

OpenAlex topics: GaN-based semiconductor devices and materials · Semiconductor materials and devices · Semiconductor Quantum Structures and Devices

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