In-situ synergistic effect of Pr and Al2O3 nanoparticles on enhancing thermal cycling reliability of Sn-0.3Ag-0.7Cu/Cu solder joint
Source abstract
Abstract
Nano-oxides with low cost are a promising class of reinforcing materials that can be added into solder to enhance reliability of resultant joints. However, the poor interfacial bonding with solder matrix has long been a barrier to its transition from laboratory science to real engineering application. In this study, rare earth Pr and Al 2O 3 nanoparticles (NPs) were co-added into Sn-0.3Ag-07Cu (SAC0307) solder to solve it, and thermal cycling reliability of resultant joint was found to be much more enhanced when compared to the joints individually added with Pr or Al 2O 3 NPs. This was attributed to a synergistic effect in-situ built between Pr atoms and Al 2O 3 NPs, in the form of Pr-coated Al 2O 3 NPs. This structure helped most Al 2O 3 NPs maintain nano-scaled during thermal cycling, and thus continuously inhibited the coarsening of interfacial microstructure for a long time. Kinetic analysis showed that the average interfacial IMCs growth coefficient at SAC0307-Pr-Al 2O 3/Cu interface was about 5.0 × 10 −11 cm 2/h, lower than that at SAC0307/Cu, SAC0307-Pr/Cu and SAC0307-Al 2O 3/Cu interface.
Source: expertdata · Quality: candidate unverified · Source record ↗
Research context
OpenAlex topics: Electronic Packaging and Soldering Technologies · Aluminum Alloys Composites Properties · Intermetallics and Advanced Alloy Properties
SciVX discovery tags are terminology-based. OpenAlex topics are source-provided classifications.
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