Quantitative microstructure characterization of self‐annealed copper films with electron backscatter diffraction

Abstract Electron backscatter diffraction (EBSD) was applied to analyze cross sections of self‐annealed copper electrodeposits, for which earlier the kinetics of self‐annealing had been investigated byin‐situX‐ray diffraction (XRD). The EBSD investigations on the grain size, grain boundary character and crystallographic texture of copper films with different thicknesses essentially supplement results fromin‐situXRD. Twin relations between neighboring grains were identified from the orientation maps and the observed twin chains confirm multiple twinning in copper electrodeposits as the mechanism of microstructure evolution at room temperature (self‐annealing). (© 2008 WILEY‐VCH Verlag GmbH & Co. KGaA, Weinheim)