Highly Microcrystalline Phosphorous‐Doped Si:H Very Thin Films Deposited by RF‐PECVD
Source abstract
Abstract
Fine‐tuning the crystallinity and doping of the hydrogenated microcrystalline silicon thin films are the key points in obtaining high‐quality devices for above‐integrated circuit (above‐IC) image sensors. This study focuses on the structural and electrical properties of radio‐frequency plasma enhanced chemical vapor deposition (RF‐PECVD) deposited microcrystalline silicon (μc‐Si:H) contact layers. Herein, phosphorus‐doped μc‐Si:H is deposited by capacitively coupled plasma RF‐PECVD (13,56 MHz) from a SiH4 + H2 + PH3gas mixture with varying phosphine concentrations. The influence of phosphine concentration on dopant concentration, active dopant concentration, and crystallinity is studied by secondary ion mass spectrometry, Hall effect measurement, and Raman spectroscopy, respectively. A high doping level is attained, reaching up to 1.7 × 1020 cm−3. Furthermore, “low‐power” and “high‐power” deposition conditions are studied which lead to incubation layers of different nature.
Source: crossref · Quality: baseline
Research context
OpenAlex topics: Thin-Film Transistor Technologies · Silicon Nanostructures and Photoluminescence · ZnO doping and properties
SciVX discovery tags are terminology-based. OpenAlex topics are source-provided classifications.
Affiliations
R&D STMicroelectronics 850 rue Jean Monnet 38 926 Crolles France
Univ Lyon INSA Lyon CNRS Ecole Centrale de Lyon Université Claude Bernard Lyon 1 CPE Lyon INL UMR5270 69621 Villeurbanne France
Funding
Association Nationale de la Recherche et de la Technologie
References (23)
Show source-provided references
1. G.Boucharlat Techniques de l'ingénieur Électronique vol. TIP350WEB Editions T.I. 2006 no. e2530 https://doi.org/10.51257/a-v1-e2530.10.51257/a-v1-e2530 ↗
2. P.Slangen N.Long P.Picart Techniques de l’ingénieur Mesures mécaniques et dimensionnelles vol. TIP673WEB Editions T.I. 2016 https://doi.org/10.51257/a-v1-r6733.10.51257/a-v1-r6733 ↗
3. P.De Moor presented atThe Tipp 2014 - Third Inter. Conf. Technology and Instrumentation in Particle Physics Effectenbeurszaal June2014 https://indico.cern.ch/event/192695/contributions/353250/ (accessed: December 2021).
4. N.Moussy P.Gidon N.Carriere W.Rabaud B.Giffard B.Gluck D.Thomas J.Prima F.Roy N.Casanova J.Regolini J. B.Chevrier F.Collet A. S.Ozanne‐Gomila O. A.Salasca 2006 Inter. Electron Devices Meeting 2006 pp.1–3 https://doi.org/10.1109/IEDM.2006.346978.10.1109/IEDM.2006.346978 ↗
5. 10.1063/1.33956410.1063/1.339564 ↗
6. 10.1016/j.jallcom.2019.07.32010.1016/j.jallcom.2019.07.320 ↗
7. 10.1143/APEX.1.03150110.1143/APEX.1.031501 ↗
8. T.Matsui H.Jia M.Kondo K.Mizuno S.Tsuruga S.Sakai Y.Takeuchi 35th IEEE Photovoltaic Specialists Conf. IEEE Honolulu HI USA2010 pp.000311–000316.10.1109/PVSC.2010.5615904 ↗
9. 10.1016/S0022-3093(99)00714-010.1016/S0022-3093(99)00714-0 ↗
10. Q.Guo X.Geng 6th Inter. Conf. Systems and Informatics (ICSAI) IEEE Shanghai China2019 pp.263–267.10.1109/ICSAI48974.2019.9010228 ↗
11. 10.1557/PROC-664-A26.5.110.1557/PROC-664-A26.5.1 ↗
12. Matsuda A. · 2017 · 573
13. 10.1557/PROC-507-50510.1557/PROC-507-505 ↗
14. 10.1016/j.vacuum.2006.09.00610.1016/j.vacuum.2006.09.006 ↗
15. 10.1016/S0022-3093(99)00769-310.1016/S0022-3093(99)00769-3 ↗
16. 10.1557/PROC-762-A6.510.1557/PROC-762-A6.5 ↗
17. 10.1063/1.12032410.1063/1.120324 ↗
18. 10.1557/PROC-452-83310.1557/PROC-452-833 ↗
19. 10.1021/ja01613a11610.1021/ja01613a116 ↗
20. 10.1002/jrs.271110.1002/jrs.2711 ↗
21. 10.1103/PhysRevB.36.334410.1103/PhysRevB.36.3344 ↗
22. 10.1063/1.9905410.1063/1.99054 ↗
23. 10.1063/1.503700810.1063/1.5037008 ↗