Theoretical simulation and preparation of binary and ternary combinatorial libraries by thermal PVD

Abstract Binary and ternary composition spread material libraries were prepared using a thermal physical vapor deposition system with three separated heating sources and adjustable chamber geometry. In this work, we present binary Cu84‐20Al16‐80 and Zn71‐8Mg29‐92 libraries as well as a ternary Cu67‐6Ag81‐13Mg66‐12 system with a thickness around 300 nm. The composition of the obtained films was determined by automated energy dispersive X‐ray spectroscopy and the data further used to develop a mathematical model to simulate the surface. The thickness of a copper film was measured by atomic force microscopy and used to verify the theoretical model, whereas topography scans provided information on the surface roughness. The consistency between theoretical simulations and observed compositions concludes multiple source thermal co‐evaporation to be a reliable method with high variety regarding source metals and deposition rates and therefore of high value for material library fabrication.