Nucleation, grain orientations, and microstructure of Sn-3Ag-0.5Cu soldered on cobalt substrates
Source abstract
Abstract
Abstract The potential of cobalt substrates to control the microstructure of 550 μm Sn-3Ag-0.5Cu ball grid array (BGA) joints is explored. It is shown that cobalt substrates give a small and reproducible nucleation undercooling for tin and prevent the formation of large primary Ag 3 Sn blades and Cu 6 Sn 5 rods. βSn dendrites grew from the CoSn 3 reaction layer and the βSn grains are shown to inherit their orientation from the CoSn 3 layer due to heterogeneous nucleation with the following orientation relationship: (100) Sn ||(100) CoSn3 with [001] Sn ||[001] CoSn3 . Changes in the dendrite and eutectic microstructure are shown to be caused by the reduced nucleation undercooling for βSn and the altered solidification path due to cobalt substrate dissolution.
Source: openaire · Quality: candidate unverified · Source record ↗
Research context
OpenAlex topics: Electronic Packaging and Soldering Technologies · Advanced Welding Techniques Analysis · Aluminum Alloy Microstructure Properties
SciVX discovery tags are terminology-based. OpenAlex topics are source-provided classifications.
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