Temperature dependence of the low-cycle fatigue behaviour of a Cu-SiO₂ bicrystal with a [011], 18° twist boundary

The temperature dependence of the low-cycle fatigue behaviour of a Cu bicrystal containing dispersed SiO2 particles and having a [011], 18° twist boundary has been studied. Failure occurred at shorter times with increasing temperature and stress amplitude. Crack nucleation took place at the particles' surfaces on the grain boundary where slip lines intersected. The crack tended to propagate along primary slip lines and this tendency became stronger as the temperature was increased.