journal article·2014-04-03Open access

Competition between Kirkendall shift and backstress in interdiffusion revisited – simple analytic model

A. Gusak, B. Wierzba, M. Danielewski

Philosophical Magazine· Volume 94· Issue 10

Abstract

We present the first simple analytical description of the interdiffusion process where the competition between the Kirkendall shift and the backstress is considered. It is shown that two diffusion subzones are formed; these sections are linked to the fast and slow diffusing component. During the interdiffusion process, the stress effect does not vanish.
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Research context

OpenAlex topics: Intermetallics and Advanced Alloy Properties · Semiconductor materials and interfaces · Surface and Thin Film Phenomena

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