Dielectric and thermal properties of isotactic polypropylene/hexagonal boron nitride composites for high-frequency applications
Source abstract
Abstract
Abstract Dielectric composites aimed for high frequency applications were prepared by using anisotropic hexagonal boron nitride (hBN) particles as a fillers and isotactic polypropylene (iPP) as polymer matrix. Dielectric and thermal properties of the composites were studied, focusing on the filler orientation in the plate-shape specimens and filler concentration up to 40 vol%. The degree of orientation of the filler was controlled by the composite fabrication process. Hot-pressing gave relatively random orientation of the filler in the matrix, while injection molding induced a high orientation. Dielectric constant ( e r ) of the composites ranged between 2.25 and 3.39. The estimation of e r based on the Bruggeman mixing model agreed well with the measured value. Low dielectric losses (tan δ ) at microwave frequencies, on the order of 10 −4 , were obtained for all the compositions. Through-thickness thermal conductivity ( k ) of the hot-pressed samples showed a drastic increase with increasing the filler concentration, reaching up to 2.1 W/m K at 40 vol% of hBN. The filler concentration dependence of k was less significant for the injection molded composites. In-plane thermal expansion was almost independent on the filler orientation, while the coefficient of thermal expansion for the thickness direction of the hot-pressed sample was reduced to approximately half of the injection molded counterpart. These differences in thermal conductivity and thermal expansion are thought to arise from the difference in hBN filler orientation.
Source: openaire · Quality: candidate unverified · Source record ↗
Research context
OpenAlex topics: Dielectric materials and actuators · Electromagnetic wave absorption materials · Thermal properties of materials
SciVX discovery tags are terminology-based. OpenAlex topics are source-provided classifications.
References (22)
Show source-provided references
1. Preparation, characterization and properties of Sm2Si2O7 loaded polymer composites for microelectronic applications10.1016/j.mseb.2009.05.007 ↗
2. Comparison of alumina and magnesia filled PTFE composites for microwave applications10.1016/j.matchemphys.2008.07.089 ↗
3. Microwave dielectric properties of PTFE/rutile nanocomposites10.1016/j.jallcom.2008.10.092 ↗
4. Rutile filled PTFE composites for flexible microwave substrate applications10.1016/j.mseb.2009.04.011 ↗
5. Low dielectric loss PTFE/CeO2 ceramic composites for microwave substrate applications10.1111/j.1744-7402.2008.02228.x ↗
6. Preparation and properties of silica filled PTFE flexible laminates for microwave circuit applications10.1016/j.compositesa.2009.05.007 ↗
7. Low dielectric loss polytetrafluoroethylene/TeO2 polymer ceramic composites10.1111/j.1551-2916.2007.01914.x ↗
8. Fabrication and properties of composites from BST and polypropylene-graft-poly(styrene-stat-divinylbenzene)10.1016/j.jeurceramsoc.2009.08.019 ↗
9. Preparation and characterization of isotactic polypropylene/MgO composites as dielectric materials with low dielectric loss10.2109/jcersj2.121.606 ↗
10. First-principles study on structural, dielectric, and dynamical properties for three BN polytypes10.1103/PhysRevB.63.115207 ↗
11. Shinde · 2006
12. Normal modes in hexagonal boron nitride10.1103/PhysRev.146.543 ↗
13. High-performance hexagonal boron nitride/bismaleimide composites with high thermal conductivity, low coefficient of thermal expansion, and low dielectric loss10.1002/pat.1992 ↗
14. Thermal behavior and dielectric property analysis of boron nitride-filled bismaleimide-triazine resin composites10.1002/app.38276 ↗
15. Complex permittivity measurement of dielectric plates by a cavity resonance method
16. JIS R 1641 Measurement method for dielectric of fine ceramic plates at microwave frequency, 2007.
17. Topotactical reactions with ferromagnetic oxides having hexagonal crystal structures10.1016/0022-1902(59)80070-1 ↗
18. Local-field effects and effective-medium theory: a microscopic perspective10.1119/1.12734 ↗
19. Thermal conductivity, elastic modulus, and coefficient of thermal expansion of polymer composites filled with ceramic particles for electronic packaging10.1002/(SICI)1097-4628(19991227)74:14<3396::AID-APP13>3.0.CO;2-3 ↗
20. Thermally conductive silicone rubber reinforced with boron nitride particle10.1002/pc.20296 ↗
21. Thermal conductivity and mechanical properties of BN-filled epoxy composite: effects of filler content, mixin conditions, and BN agglomerate size10.1177/0021998310393297 ↗
22. Lattice parameters and anisotropic thermal expansion of hexagonal boron nitride it the 10–297.5K temperature range10.1007/s003390100999 ↗