Effects of intermetallic compound on the electrical and mechanical properties of friction welded Cu/Al bimetallic joints during annealing

Abstract Al/Cu metal joints applied for the electrical connector was joined by the friction welding method to limit the formation of intermetallic compound under optimum friction welding condition. To guarantee the reliability of the Al/Cu joints in service requirement, the effects of the intermetallic compound layer on the electrical and mechanical properties have been investigated under various annealing conditions. Two kinds of intermetallic compounds layer were formed in the joints interface and identified by AlCu and Al 2 Cu. The growth kinetic of these intermetallics during the annealing can be followed by volume diffusion process. The activation energy of Al 2 Cu, AlCu and total intermetallic compound (AlCu + Al 2 Cu) represented 107.5, 98.42 and 110.22 kJ/mol, respectively. A thicker intermetallic compound layers could seriously degrade the electrical resistivity and tensile strength. The electrical resistivity with 21 μm thickness of intermetallic compound was 45 μΩ cm and increased to be 85 μΩ cm with 107 μm of intermetallic compound. Tensile strength remarkably decreased from 85 MPa to near zero at the annealing condition of 773 K and 129.6 ks and fracture occurred through the intermetallic compound layers.