Thermal reliability of the metal/polyetherimide bond

Abstract Recent advances in the pretreatment of polyetherimide surfaces have enabled the deposition of adherent metal coatings. The bond between the metal and plastic has been found to be predominantly chemical in nature. The thermal reliability of the metal/polymer bond was evaluated in accelerated aging tests. The metal/polyetherimide bond was found to be insensitive to prolonged contact (200 h) to 65°C and 100% relative humidity (RH) environments or 85°C and dry or 85% RH conditions. Thermal and humidity cycling (IBM 4.4.16) had no effect on either the metal/ polymer bond strength or the surface resistivity of the metal coating. Exposing metallized specimens to extreme and rapid thermal changes, +150°C to -196°C and less than 15 s transfer time between temperatures, further revealed the durability of the bond. Exposure to simulated soldering conditions representing multiple dwells at temperatures between 232 and 288°C and times of 5 or 10 s had no effect on adhesion. The importance of a prebake prior to soldering is discussed in terms of the chemical and mechanical components of adhesion. Keywords: Adhesioncopper/polyetherimideaccelerated agingthermal reliability