journal article·1994-01

Nondestructive dynamic evaluation of thin NiTi film adhesion

Quanmin Su, Susan Z. Hua, Manfred Wuttig

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Abstract

Abstract Thin layer materials may be considered as composites of the substrate and deposited film. The degree of stress transfer between the two components, i.e. the adhesion, will influence the dynamical response of the thin layer composite characterized by its resonance frequency. A semi-empirical adhesion parameter γ was defined which varies between 1, indicating perfect adhesion, and 0, indicating no adhesion. Resonance measurements were carried out on the Ni50Ti50/SiO2/Si system, employing a high-resolution mechanical vibration technique. To confirm that the parameter γ truly reflects the quality of the adhesion, NiTi films of different thicknesses were sputter-deposited on a Si substrate and 1 - γ, reflecting the degree of deviation from pure elastic coupling through the interface, was measured. It was found that NiTi/Si yields γ values of about 0.8, reflecting partial adhesion. Annealing improves the adhesion of NiTi films on Si. This improvement of the adhesion was followed in situ. Keywords: AdhesionnondestructiveNiTi thin filmsdynamic responsevibrating reed
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Research context

OpenAlex topics: Adhesion, Friction, and Surface Interactions · Metal and Thin Film Mechanics · Acoustic Wave Resonator Technologies

SciVX discovery tags are terminology-based. OpenAlex topics are source-provided classifications.

References (14)

Show source-provided references
1. Mittal, K. L., ed. 1978.Adhesion Measurement of Thin Films, Thick Films and Bulk Coatings, 5Philadelphia, PA: ASTM.10.1520/STP640-EB ↗
2. Valli J. · J. Vac Sci. Technol. A · 1986 · 4 · 300710.1116/1.573616 ↗
3. Thouless M. D. · Thin Solid Films · 1989 · 181 · 39710.1016/0040-6090(89)90508-7 ↗
4. Good, R. J. 1978.Adhesion Measurement of Thin Films, Thick Films and Bulk Coatings, Edited by: Mittal, K. L. 18Philadelphia, PA: ASTM.10.1520/STP38621S ↗
5. Berry, B. S. 1988.Diffusion Phenomena in Thin Films and Microelectronic Materials, Edited by: Gupta, D. and Ho, P. S. 73Park Ridge, NJ: Noyes.
6. Wuttig, M. and Su, C. M. 1993.Dampings of Multiphase Inorganic Materials, Edited by: Bhagat, R. B. 159ASM International.
7. Hua, S. Z., Su, C. M. and Wuttig, M. 1993.Thin Films -Stress and Mechanical Properties, Vol. 308, 525Pittsburgh: MRS Press. Mater. Res. Soc. Proceedings10.1557/PROC-308-33 ↗
8. Vollkommer F. · 1989
9. Bohn, H. G., Vollkommer, F. and Robrock, K.H. 1990.Internal Friction and Ultrasonics Attenuation in Solids, Edited by: Kê, T. S. 587Oxford: Pergamon Press.
10. Nowick A. S. · 1972
11. Brantley W. A. · J. Appl. Phys. · 1973 · 44 · 53410.1063/1.1661935 ↗
12. George M. A. · J. Vac. Sci. Technol. A · 1990 · 8 · 149110.1116/1.576863 ↗
13. Gleiter H. · Progr. Mater. Sci. · 1972 · 16 · 110.1016/0079-6425(72)90017-5 ↗
14. Kê T. S. · Phys. Rev. · 1947 · 71 · 53310.1103/PhysRev.71.533 ↗