Effect of phenol formaldehyde resin on the adhesion properties of butyl rubber–polyester proofed fabric

Phenol formaldehyde resin was used as an adhesion promoter additive to two bonding system: resorcinol and m-phenylenediamine. These two systems were used to produce butyl rubber–polyester proofed fabric. The addition of resin led to better adhesion properties. The coated fabrics were exposed to heat aging and ionizing radiation. The permeability, dielectric properties, and the electrical resistivity of the coated fabrics were examined.