Drop Test Performance of Isotropic Electrically Conductive Adhesives
Source abstract
Abstract
Drop test survival is a crucial element of isotropic conductive adhesive (ICA) reliability. Drop test data are presented for four different ICA materials, with varying cure profiles. Only one of the materials passes the ad hoc standard (including none of the “snap cure” formulations, although performance is improved by extended cure times). Drop test performance deteriorates when the sample has survived a series of smaller drops, leading to a cumulative damage model based on crack initiation at interface bubbles, and is improved by a pre-cure heat soak to drive off the bubbles.
Source: openalex_inverted_index · Quality: baseline
Research context
OpenAlex topics: Electronic Packaging and Soldering Technologies · Recycling and Waste Management Techniques · Electrostatic Discharge in Electronics
SciVX discovery tags are terminology-based. OpenAlex topics are source-provided classifications.
References (13)
Show source-provided references
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