Adhesion characteristics of plasma-surface-treated carbon fiber-epoxy composite with respect to release films used during demolding

Abstract The load capabilities of carbon fiber-epoxy composite adhesive joints are affected by surface characteristics of the composite adherends such as surface free energy and chemical composition, which can be altered by plasma surface treatment and the type of release film for demolding carbon fiber-epoxy composites from metal molds. In this paper, suitable plasma surface treatment conditions for carbon fiber-epoxy composite adherends were investigated to enhance the strength of carbon fiber-epoxy composite adhesive joints using dielectric barrier discharges of atmospheric pressure plasmas. The effects of plasma surface treatment on the surface free energy and adhesion strength of carbon fiber-epoxy composites were experimentally investigated with respect to surface treatment time. Also, the surface and adhesion characteristics of carbon fiber-epoxy composites were investigated with respect to release films such as fluorinated ethylene propylene (FEP), high density polyethylene (PE) and Nylon 6.6. Quantitative chemical bonding analysis with X-ray photoelectron spectroscopy (XPS) was also performed to understand the load capabilities of composite adhesive joints with respect to plasma treatment time and release films. From the experimental results, it was found that plasma treatment of carbon fiber-epoxy composites did enhance its adhesion strength, irrespective of the type of release film. Regarding adhesion strength, Nylon 6.6 was found to be the most suitable release film for these composites when no plasma treatment could be applied. From the XPS measurements on carbon fiber-epoxy composites, it was found that the carbon bond ratio of C=O to C-C and C-H reached a maximum at around 10 s treatment time, which corresponded well with the load transmission capability of the composite adhesive joint. Keywords: ADHESIVE JOINTSURFACE TREATMENTCARBON FIBER-EPOXY COMPOSITEDIELECTRIC BARRIER DISCHARGEATMOSPHERIC PRESSURE PLASMARELEASE FILMCONTACT ANGLESURFACE FREE ENERGYAFMSEMXPS.