A two-dimensional finite element thermal stress analysis of adhesive butt j oints containing some hole defects

Thermal stress distributions in adhesive butt joints containing some hole defects under uniform temperature changes were analyzed using a two-dimensional finite element method (FEM). Four kinds of adhesive butt joints which contained no hole, 3-hole, 8-hole, and 16-hole defects in the adhesive layer were studied. In particular, the stress concentrations around the hole defects and near the edges of the interface between the adherends and the adhesive were examined. From the results, the thermal stresses around the hole defects located near the center of the adhesive were found to be larger than those around the hole defects located near the free surface of the adhesive. The thermal stress near the edges of the interface decreased with an increase in the number of holes and a decrease in Young's modulus of the adhesive. For verification, photoelastic experiments were carried out and fairly good agreement was seen between the numerical and the experimental results.