Effects of environment and heat treatment on an oxygen plasma-treated polyimide surface and its adhesion to a chromium overcoat
Source abstract
Abstract
Abstract —The effects of oxygen plasma treatment time, duration of storage, and heat treatment on the surface chemistry of and Cr adhesion to Dupont RC5878 and Kapton polyimides were investigated using X-ray photoelectron spectroscopy (XPS), and contact angle and peel strength measurements. The XPS results indicate that the initial stage of plasma treatment involves oxygen adsorption with insignificant modification of the surface chemistry. After 5 s of plasma treatment the surface chemistry is modified, as suggested by the changes in the carbonyl and partially oxidized carbon functional groups' contributions to the C(1s) line shape. These modifications resulted in an increase in the peel strength and a decrease in the contact angle of water. Over the first month of storage, the intensity of the carbonyl functional group peak decreased, while the contact angle increased and reached a steady-state value of 30° after 20 days of storage. These changes are mainly attributed to moisture absorption. Importantly, the metal adhesion to polyimide remained fairly constant over the storage period. The aged plasma-treated surface experienced loss of moisture when baked at 150°C for less than 5 min. This was followed by an increase of the partially oxidized carbon at the expense of the plasma-induced carbon-oxygen bonds at higher baking temperatures or longer times. Keywords: XPScontact anglepolyimideplasmaadhesion
Source: openalex_inverted_index · Quality: baseline
Research context
OpenAlex topics: Synthesis and properties of polymers · Silicone and Siloxane Chemistry · Tribology and Wear Analysis
SciVX discovery tags are terminology-based. OpenAlex topics are source-provided classifications.
References (16)
Show source-provided references
1. Ho P. S. · J. Vac. Sci. Technol. · 1985 · 3 · 739
2. Chou N. J. · J. Vac. Sci. Technol. · 1984 · 2 · 75
3. Hahn P. O. · Mater. Res. Soc. Symp. Proc. · 1985 · 40 · 253
4. Silverman B. D. · J. Polym. Sci., Polym. Chem. Ed. · 1985 · 23 · 285710.1002/pol.1985.170231113 ↗
5. Ohuchi F. · J. Vac. Sci. Technol. · 1986 · 4 · 103910.1116/1.573450 ↗
6. Jordan J. L. · J. Vac. Sci. Technol. · 1986 · 4 · 104110.1116/1.583577 ↗
7. Leary, H. J. and Campbell, D. S. 1981.Photon, Electron, and Ion Probes of Polymer Structure and Properties, American Chemical Society Symposium Series No. 162 Edited by: Dwight, D. W., Fabish, T. J. and Thomas, H. R. 419Washington, DC
8. Atanasoska L. J. · J. Vac. Sci. Technol. · 1987 · 5 · 332510.1116/1.574191 ↗
9. Bucci G. D. · Printed Circuits Fabrication · 1986 · 22
10. Allara D. L. · Mater. Sci. Eng. · 1986 · 83 · 21310.1016/0025-5416(86)90339-3 ↗
11. Eggito F. D. · J. Vac. Sci. Technol. · 1985 · 3 · 895
12. Mittal K. L. · Electrocomponent Sci. Technol. · 1976 · 3 · 2110.1155/APEC.3.21 ↗
13. Russel T. P. · J. Polym. Sci.: Phys. Ed. · 1983 · 21 · 174510.1002/pol.1983.180210912 ↗
14. Shirley D. A. · Phys. Rev. · 1972 · 5 · 470910.1103/PhysRevB.5.4709 ↗
15. Suhr H. · Plasma Chem. Plasma Proc. · 1983 · 3 · 110.1007/BF00566027 ↗
16. Abell, P. I. 1976.Addition of Atoms and Radicals to Double and Triple Bond in Chemical Kinetics, Edited by: Bamford, C. H. and Tripper, C. F. H. 111Amsterdam: Elsevier.10.1016/S0069-8040(08)70123-7 ↗