The effect of pressure on the initial establishment of conductive paths in electronically conductive adhesives
Source abstract
Abstract
In order to understand and to be able to affect the efficiency of electrical conduction in particle-filled conductive adhesives, the mechanism of interparticle conduction is modeled theoretically and assessed experimentally. We predict and show that the electrical resistance of powders is dependent on the external pressure applied on them. A pressure-dependent model is developed to predict interparticle electric conduction by representing interparticle contact resistance as the sum of constriction resistance and tunneling resistance. The theoretical model developed is confirmed experimentally using 9-μm diameter spherical nickel particles under pressure.
Source: openalex_inverted_index · Quality: baseline
Research context
OpenAlex topics: Electronic Packaging and Soldering Technologies · Advanced Sensor and Energy Harvesting Materials · Adhesion, Friction, and Surface Interactions
SciVX discovery tags are terminology-based. OpenAlex topics are source-provided classifications.
References (10)
Show source-provided references
1. Sancaktar, E. and Wei, Y. 1995.1995 Proceedings, International Symposium on Microelectronics, 231–236. Reston, VA: International Society of Hybrid Microelectronics.
2. Pernice, R. F., Hannafin, J. J. and Estes, R. H. 1994.1994 Proceedings, International Symposium on Microelectronics, 561–569. Reston, VA: International Society of Hybrid Microelectronics.
3. Nguyen, G., Williams, J. and Gibson, F. 1992.1992 Proceedings, International Symposium on Microelectronics, 510–517. Reston, VA: International Society of Hybrid Microelectronics.
4. Honore, J., Rubin, H. and Zierold, M. 1992.Proceedings of the Technical Program, National Electronic Packaging and Production Conference, Vol. 3, 1372–1380. Des Plains, IL: Cahner Exposition Group.
5. Brendfelt, K., Dral, J. and Wells, B. 1989.Proceedings of the Technical Program, Nepcon West '89, Vol. 1, 496–506. Des Plains, IL: Cahner Exposition Group.
6. Date, H., Hozumi, Y., Tokuhira, H., Usui, M., Horikoshi, E. and Sato, T. 1994.1994 Proceedings, Inter- national Symposium on Microelectronics, 570–575. Reston, VA: International Society of Hybrid Microelectronics.
7. Holm R. · 196710.1007/978-3-662-06688-1 ↗
8. Timoshenko S. P. · 1970
9. Jozavi H.
10. Hull, D. 1981.An Introduction to Composite Materials, 29Cambridge: Cambridge University Press.