Effects of various adherend surface treatments on fatigue behavior of joints bonded with a silver-filled electronically conductive adhesive
Source abstract
Abstract
Abstract Conductive adhesives have been used in a variety of electronic packaging applications. This paper presents an investigation into the effects of various adherend surface treatments on the fatigue and failure behaviors of adhesively-bonded joints. For this purpose, single-lap joints were fabricated using specimens with adherend surfaces modified employing various chemical and mechanical modification techniques, and tested under a spectrum of fatigue and environmental conditions. The results of our work indicate a profound influence of the adherend surface on both the fatigue behavior and also the moisture ingress mechanism into the joint. Finally, experiments were conducted to assess the effect of adherend surface condition on the moisture ingress mechanism. Keywords: ELECTRONICALLY CONDUCTIVE ADHESIVESFATIGUEELEVATED TEMPERATUREELEVATED HUMIDITYCYCLIC LOADINGFRACTUREENDURANCE LIMITP-N CURVECYCLIC CREEPRATE EFFECTSILANE TREATMENTGRIT BLASTINGPLASMA TREATMENTMODE-IMODE-IIICRACK GROWTH
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Research context
OpenAlex topics: Mechanical Behavior of Composites · Electronic Packaging and Soldering Technologies · Synthesis and properties of polymers
SciVX discovery tags are terminology-based. OpenAlex topics are source-provided classifications.
References (52)
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