Effect of intermetallic compound evolution on tensile damage mechanical properties of Cu/Sn micro-solder joints under multi-field coupling
Source abstract
Abstract
Elevated concentrations of intermetallic compounds (IMC) in micro-solder joints adversely affect their mechanical properties. To elucidate damage evolution trends in these joints with varying IMC thicknesses under multi-field coupling, an initial IMC evolution model was formulated by employing the phase-field method. By adjusting current densities, models with diverse IMC thicknesses were generated. Experimental investigations, including IMC evolution analysis and tensile testing, determined critical damage parameters, enabling the formulation of a scalar damage model specific to micro-solder joints. Statistical analysis revealed that as IMC thickness increased, anodic damage remained confined within the IMC layer, while cathodic damage transitioned from the IMC layer to the IMC-Sn solder interface, ultimately damaging the Sn solder layer. Additionally, thicker IMC micro-solder joint models exhibited damage at lower separation displacements and encompassed larger damage areas.
Source: openalex_inverted_index · Quality: baseline
Research context
OpenAlex topics: Electronic Packaging and Soldering Technologies · Advanced Welding Techniques Analysis · 3D IC and TSV technologies
SciVX discovery tags are terminology-based. OpenAlex topics are source-provided classifications.
Affiliations
School of Mechanical and Intelligent manufacturing, Chongqing University of Science and Technology
School of Civil and Hydraulic Engineering, Chongqing University of Science and Technology
Funding
National Natural Science Foundation of China
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