Relationship between thermal curing behavior and bond strength development in formaldehyde-based resins with different molecular weights

Urea–formaldehyde (UF) and phenol–formaldehyde (PF) resins are the most widely used adhesives in the production of wood composites, and are cured through hot-pressing to provide adhesion strength with the composites. This study investigates the relationship between thermal curing behavior monitored by differential scanning calorimetry (DSC) and adhesive bond strength development measured by an automated bonding evaluation system (ABES) for UF and PF resins with different molecular weights (Mw). DSC results demonstrated that UF resins cured faster than PF resins, as indicated by a lower apparent activation energy (Ea). In addition, UF and PF resins with lower Mw cured faster in the early stages of curing and slower in the latter stages of curing as compared to higher-Mw resins. Furthermore, according to the ABES results, when increasing the molecular weight, both UF and PF resins exhibited greater adhesive bond strength, irrespective of pressing parameters (temperature and time). The isothermal DSC and ABES results demonstrated that the adhesive bond strength increased with an increase in the degree of cure of the resins, indicating a correlation between them. It also showed that UF resins attained optimal adhesive bond strength at low temperature (110–130 °C) in roughly 180 s while PF resins attained it at high temperature (120–130 °C) in about 300 s. However, the degree of cure under isothermal scans was inconsistent with temperatures. These results indicate that the degree of cure is closely related to the adhesion strength development of UF and PF resins which are curing at low and high temperatures to obtain the optimum adhesion strength.