Characterization of fracture energy and toughness of air plasma PDMS–PDMS bonding by T-peel testing
Source abstract
Abstract
The fracture energy, toughness and failure modes of air plasma oxidized polydimethylsiloxane (PDMS) bonding are evaluated in this paper. Each PDMS–PDMS bonded specimen was subjected to T-peel testing at a constant-displacement rate. The load–extension curve from each test was analyzed by the principle of energy balance in linearly elastic fracture mechanics, to calculate the fracture energy (critical strain energy), which is the maximal strain energy a bonded specimen can withstand without losing its assembly integrity, and toughness (surface energy), which is the bonding energy at the interface. A distribution of calculated values against the air plasma treatment parameters shows the predominant range of 0.1 to 0.4 N/mm for fracture energy and 0.1 to 0.2 N/mm for toughness. Together with an analysis of three failure modes (cohesive, adhesive, and mixed), the results suggest 0.1 N/mm as the threshold of the fracture energy for weak bonding, below which a specimen will be likely to fail through debonding. A set of treatment parameters are recommended for using air plasma to achieve strong bonding.
Source: openalex_inverted_index · Quality: baseline
Research context
OpenAlex topics: Advanced Sensor and Energy Harvesting Materials · Surface Modification and Superhydrophobicity · Adhesion, Friction, and Surface Interactions
SciVX discovery tags are terminology-based. OpenAlex topics are source-provided classifications.
Affiliations
Department of Mechanical Engineering, University of Alaska Fairbanks, Fairbanks, AK, USA
Funding
National Aeronautics and Space Administration
References (48)
Show source-provided references
1. 10.1038/nprot.2009.23410.1038/nprot.2009.234 ↗
2. 10.1002/(ISSN)1521-377310.1002/(ISSN)1521-3773 ↗
3. 10.1016/j.mechmat.2010.09.00510.1016/j.mechmat.2010.09.005 ↗
4. 10.1016/j.sna.2009.01.02610.1016/j.sna.2009.01.026 ↗
5. 10.1016/j.biomaterials.2004.08.00910.1016/j.biomaterials.2004.08.009 ↗
6. 10.1088/0960-1317/24/3/03501710.1088/0960-1317/24/3/035017 ↗
7. 10.1016/j.mee.2008.02.00410.1016/j.mee.2008.02.004 ↗
8. 10.1016/j.memsci.2014.12.04310.1016/j.memsci.2014.12.043 ↗
9. 10.1002/(ISSN)1099-048810.1002/(ISSN)1099-0488 ↗
10. 10.1016/j.chroma.2008.09.00610.1016/j.chroma.2008.09.006 ↗
11. 10.1088/0960-1317/21/6/06502410.1088/0960-1317/21/6/065024 ↗
12. 10.1002/app.1970.07014100610.1002/app.1970.070141006 ↗
13. Graubner VM · Polym Mater: Sci Eng · 2003 · 88 · 488
14. 10.1080/0021846950801437910.1080/00218469508014379 ↗
15. 10.1002/(ISSN)1522-268310.1002/(ISSN)1522-2683 ↗
16. 10.1109/84.82578010.1109/84.825780 ↗
17. 10.1002/(ISSN)1613-682910.1002/(ISSN)1613-6829 ↗
18. 10.1126/science.288.5463.11310.1126/science.288.5463.113 ↗
19. 10.1016/j.snb.2006.08.03710.1016/j.snb.2006.08.037 ↗
20. 10.1039/C4SM02840F10.1039/C4SM02840F ↗
21. 10.4028/www.scientific.net/AST.81.9610.4028/www.scientific.net/AST.81.96 ↗
22. 10.1016/j.colsurfa.2004.11.01010.1016/j.colsurfa.2004.11.010 ↗
23. 10.1021/la062772010.1021/la0627720 ↗
24. Harrick Plasma. Benefits of plasma treatment for microfluidic device fabrication. [cited 2014]. Available from: http://harrickplasma.com/applications/microfluidic-devices.
25. 10.1088/0960-1317/18/6/06700110.1088/0960-1317/18/6/067001 ↗
26. 10.1088/1742-6596/34/1/02610.1088/1742-6596/34/1/026 ↗
27. 10.1039/C0LC00272 K10.1039/C0LC00272 K ↗
28. 10.1039/C6RA25947B10.1039/C6RA25947B ↗
29. Lu Y-W · Proc Nanotech · 2007 · 2 · 190
30. 10.1109/JMEMS.2005.84474610.1109/JMEMS.2005.844746 ↗
31. 10.1021/la011098d10.1021/la011098d ↗
32. 10.1021/la035552 k10.1021/la035552 k ↗
33. 10.1039/C7SM00447H10.1039/C7SM00447H ↗
34. 10.1163/156856189X0024510.1163/156856189X00245 ↗
35. International Standard ISO 11339. Adhesives T-peel test for flexible-to-flexible bonded assemblies; 2003.
36. ASTM · 2015
37. 10.1080/0021846060087614210.1080/00218460600876142 ↗
38. 10.1016/j.polymer.2010.06.05410.1016/j.polymer.2010.06.054 ↗
39. 10.1098/rspa.1967.016010.1098/rspa.1967.0160 ↗
40. 10.1088/0960-1317/26/10/10501910.1088/0960-1317/26/10/105019 ↗
41. 10.1021/jp990648210.1021/jp9906482 ↗
42. 10.1163/156856194X0094210.1163/156856194X00942 ↗
43. 10.1016/S0032-3861(00)00039-210.1016/S0032-3861(00)00039-2 ↗
44. 10.1557/JMR.2008.002910.1557/JMR.2008.0029 ↗
45. 10.1163/1568561036047241110.1163/15685610360472411 ↗
46. 10.1016/0032-3861(81)90068-910.1016/0032-3861(81)90068-9 ↗
47. 10.1088/0963-0252/9/4/30710.1088/0963-0252/9/4/307 ↗
48. 10.1007/s10404-010-0724-y10.1007/s10404-010-0724-y ↗