journal article·2012-10-01

Surface Modification of a Photo-Definable Epoxy Resin with Polydopamine to Improve Adhesion with Electroless Deposited Copper

David Schaubroeck, Emilie Van Den Eeckhout, Johan De Baets, Peter Dubruel, Luc Van Vaeck, André Van Calster

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Abstract

Abstract This paper describes the influence of polydopamine surface modifications on the adhesion strength of electroless deposited copper on roughened epoxy resin substrates. The surfaces are characterized with XPS and ToF-S-SIMS. Next, a thorough investigation of the copper–epoxy interface is performed using SEM. Both the polydopamine modification and the variation of the electroless plating bath temperature lead to new insights into the different contributions of chemical and physical adhesion to the overall adhesion strength.
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Research context

OpenAlex topics: Polymer Surface Interaction Studies · Molecular Junctions and Nanostructures · Corrosion Behavior and Inhibition

SciVX discovery tags are terminology-based. OpenAlex topics are source-provided classifications.

Affiliations

a Centre for Microsystems Technology (CMST)/ELIS, IMEC , Ghent University , Technologiepark 914A, B-9052, Ghent–Zwijnaarde , Belgium

b Polymer Chemistry and Biomaterials Research Group, Ghent University , Krijgslaan 281, Building S4 is, B-9000, Ghent , Belgium

c Department of Chemistry , University of Antwerp (UIA) , Universiteitsplein 1, B-2610, Wilrijk , Belgium

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