Recent Advances in Nano-conductive Adhesives
Source abstract
Abstract
Abstract Nano-conductive adhesives have been attracting more and more interest in microelectronic packaging field due to their unique electrical and mechanical properties compared to conventional conductive adhesives. There has been extensive research on nano-conductive adhesives which contain nano-fillers such as nano-particles, nano-wires or carbon nano-tubes. This paper provides a comprehensive review of most recent advances in nano-conductive adhesives. Keywords: ISOTROPIC CONDUCTIVE ADHESIVESANISOTROPIC CONDUCTIVE ADHESIVESNANO-WIRESNANO-PARTICLESCARBON NANO-TUBESCONDUCTIVITYSELF-ASSEMBLED MONOLAYERSSILVER MIGRATIONFINE PITCH FLIP CHIP INTERCONNECTION
Source: openalex_inverted_index · Quality: baseline
Research context
OpenAlex topics: Carbon Nanotubes in Composites · Electronic Packaging and Soldering Technologies · Nanofabrication and Lithography Techniques
SciVX discovery tags are terminology-based. OpenAlex topics are source-provided classifications.
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